Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Conference contribution Techno-economic analysis of battery storage systems and hydrogen- based storage systems as an alternative to grid expansion in the medium voltage grid in Germany (2023) Teske F, Schubert J, Fehrle A, Funk F, Franke J Journal article Investigation of Insulation Layers on Additive Manufactured Electrical Steel Laminations in Electric Motors (2023) Ziegler M, Schafer P, Wieprecht N, Franke J, Kühl A Journal article Augmented Virtuality Input Demonstration Refinement Improving Hybrid Manipulation Learning for Bin Picking (2023) Blank A, Zikeli L, Reitelshöfer S, Karlidag E, Franke J Conference contribution Metallic Plate-Lattice-Structures for a Modular and Lightweight Designed Die Casting Tool (2023) Winter B, Schwab J, Hürkamp A, Müller SN, Dröder K Book chapter / Article in edited volumes Attributes for open innovation with automotive suppliers in new product development: a case study of the electrical and electronic system (2023) Nguyen HG, Kuhn M, Franke J Journal article Influence of Cable Lug Properties on the Torsional Ultrasonic Crimping Process of High-Frequency Litz Wires (2023) Seefried J, Wieprecht N, Franke J, Kühl A Conference contribution Innovative robot tool for full-automatic handling and wiring of deformable linear cables (2023) Fröhlig S, Nguyen HG, Piechulek N, Franke J Conference contribution Manipulation of Deformable Linear Objects Enabled by Sound-event Classification in the Manufacturing Environment (2023) Nguyen HG, Javaheri N, Franke J Conference contribution Anomaly Detection for Dispensing of Solder Paste on 3D Circuit Carriers Using Machine Learning (2023) Thielen N, Wagner M, Meier S, Voigt C, Franke J Conference contribution