Lehrstuhl für Elektronische Bauelemente

Adhesion strength of ductile thin film determined by cross-sectional nanoindentation (2024) Zhao D, Letz S, Jank M, März M Journal article Entwicklung und Optimierung eines Ball-Wedge-Wirebond-Prozesses für kleine Kontaktpads (2024) Schmid F Thesis Utilizing direct Zener tunneling in Germanium for cryogenic quantum applications (2024) Hack M, Seidel L, Wanitzek M, Oehme M, Schulze J, Schwarz D Journal article Fast Estimation of the Lateral Fidelity of Ion Implantation in 4H-SiC through Calibration to JFET Transfer Characteristics in TCAD (2024) Böttcher N, Sakai K, Szabo M, Beuer S, Rommel M Journal article, Report Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 550◦C (2024) Böttcher N, Kauth J, Rommel M, May A, Baier L, Jank M Journal article, Original article Fundamentals of ammonothermal growth of nitride crystals (2024) Chirala VYMR, Schimmel S Conference contribution, Abstract of a poster Increasing 4H-SiC Trench Depth by Improving the Dry Etch Selectivity towards the Oxide Hard Mask (2024) Rusch O, Brueckner K, Erlbacher T Book chapter / Article in edited volumes A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C (2024) May A, Rommel M, Baier L, Schraml M, Dick J, Jank M, Schulze J Conference contribution Integrated Mask Process Modeling for Better Yield Predictions (2024) Awad A, Behroozi C, Erdmann A Conference contribution Quantum enhanced electric field mapping within semiconductor devices (2024) Scheller D, Hrunski F, Schwarberg J, Knolle W, Soykal ÖO, Udvarhelyi P, Narang P, et al. Journal article, Letter