Lehrstuhl für Elektronische Bauelemente


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Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Automated quantitative analysis of void morphology evolution in Ag[sbnd]Ag direct bonding interface after accelerated aging (2021) Yu Z, Xu T, Letz S, Bayer CF, Schletz A, März M Journal article Combined dynamic operation of PEM fuel cell and continuous dehydrogenation of perhydro-dibenzyltoluene (2021) Geiling J, Steinberger M, Ortner F, Seyfried R, Nuss A, Uhrig F, Lange C, et al. Journal article Accurate prediction of EUV lithographic images and 3D mask effects using generative networks (2021) Awad A, Brendel P, Evanschitzky P, Woldeamanual DS, Rosskopf A, Erdmann A Journal article Factors influencing the gas bubble evolution and the cristobalite formation in quartz glass Cz crucibles for Czochralski growth of silicon crystals (2021) Hirsch A, Schulze M, Sturm F, Trempa M, Reimann C, Friedrich J Journal article Temperature analysis of the Gaussian distribution modeling the barrier height inhomogeneity in the Tungsten/4H-SiC Schottky diode (2021) Toumi S, Ouennoughi Z, Weiß R Journal article X-Ray diffraction analysis and modeling of the depth profile of lattice strains in AlGaN stacks (2021) Rafaja D, Fischer P, Barchuk M, Motylenko M, Roeder C, Besendoerfer S, Meißner E Journal article Beam-induced heating at low electron fluxes during liquid phase transmission electron microscopy (2021) Fritsch B, Hutzler A, Wu M, Vogl L, Jank M, März M, Spiecker E Journal article, Original article Removing the orientational degeneracy of the TS defect in 4H-SiC by electric fields and strain (2021) Rühl M, Lehmeyer J, Nagy R, Weißer M, Bockstedte M, Krieger M, Weber HB Journal article, Letter Narrow inhomogeneous distribution of spin-active emitters in silicon carbide (2021) Nagy R, Dasari DBR, Babin C, Liu D, Vorobyov V, Niethammer M, Widmann M, et al. Journal article Hybrid Additive Manufacturing by Embedded Electrical Circuits Using 3-D Dispensing (2021) Schmidt K, Polzinger B, Metry M, Koppe S, Zimmermann A Journal article