Department Werkstoffwissenschaften

Deposition of uniform and well adhesive diamond layers on planar tungsten copper substrates for heat spreading applications (2006) Glaser A, Jentsch HG, Rosiwal S, Lüdtke A, Singer R Journal article, Original article Integralschaumgießen von Leichtmetallen (2006) Körner C, Hirschmann M, Wiehler H, Trepper A, Singer R Conference contribution Effective alloy development using Thixomolding focussing on improved creep strength of AZ91 (2006) Eibisch H, Lohmüller A, Scharrer M, Singer R Conference contribution Analog Signal Processing with Organic FETs (2006) Gay N, Fischer WJ, Halik M, Klauk H, Zschieschang U, Schmid G Journal article, Report Decyl-end-capped thiophene-phenylene oligomers as organic semiconducting materials with improved oxidation stability (2006) Ponomarenko SA, Kirchmeyer S, Elschner A, Alpatova NM, Halik M, Klauk H, Zschieschang U, Schmid G Journal article, Report A novel route towards graphite products via powder injection moulding of carbon mesophase using a partially water-soluble binder system (2006) Derfuß B, Gruhl M, Rottmair CA, Volek A, Singer R Conference contribution Investigation of the charge carrier concentration in highly aluminum doped SiC using Raman scattering (2006) Müller R, Künecke U, Thuaire A, Mermoux M, Pons M, Wellmann P Journal article Basal plane dislocation dynamics in highly p-type doped versus highly n-type doped SiC (2006) Wellmann P, Queren D, Müller R, Sakwe A, Künecke U Journal article, Original article Integral foam moulding of light metals (2006) Körner C, Hirschmann M, Wiehler H Journal article, Original article Opportunities and Challenges for the New Nickel Base Alloy 718Plus (2006) Schreiber K, Löhnert K, Singer R Conference contribution