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Lehrstuhl für Leistungselektronik (LEE)
Friedrich-Alexander-Universität Erlangen-Nürnberg
Technische Fakultät
Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Overview
Publications
(179)
Research Grants
(11)
Types of publications
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Journal article
Journal article
Book chapter / Article in edited volumes
Book chapter / Article in edited volumes
Authored book
Authored book
Translation
Translation
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Thesis
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Edited Volume
Conference contribution
Conference contribution
Other publication type
Other publication type
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Unpublished / Preprint
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Filters (inactive)
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board (2022)
Müller J, Letz S, Simon FB, Bayer CF, Schletz A, Görlich J, Nishimura T
Journal article
A Resonant Push-Pull DC-DC Converter With an Intrinsic Current Source Behavior For Radio Frequency Power Conversion (2022)
Weitz N, Utzelmann S, Ditze S, März M
Journal article
Profitability of low-temperature power electronics and potential applications (2022)
Büttner S, März M
Journal article
Analytical Calculation of the RMS Value and the Spectrum of the DC-Link Current of a Dual-Inverter (2022)
Schiedermeier M, Schlamp F, Rettner C, März M
Journal article
Automated quantitative analysis of void morphology evolution in Ag[sbnd]Ag direct bonding interface after accelerated aging (2021)
Yu Z, Xu T, Letz S, Bayer CF, Schletz A, März M
Journal article
Combined dynamic operation of PEM fuel cell and continuous dehydrogenation of perhydro-dibenzyltoluene (2021)
Geiling J, Steinberger M, Ortner F, Seyfried R, Nuss A, Uhrig F, Lange C, et al.
Journal article
Beam-induced heating at low electron fluxes during liquid phase transmission electron microscopy (2021)
Fritsch B, Hutzler A, Wu M, Vogl L, Jank MP, März M, Spiecker E
Journal article, Original article
Review-based Selection Recommendation for Galvanically Isolated DC/DC Converters Designed for a Wide Input Voltage Range (2021)
Gerstner M, März M, Dietz A
Conference contribution
Fast Numerical Power Loss Calculation for High-Frequency Litz Wires (2021)
Ehrlich S, Roßmanith H, Sauer M, Joffe C, März M
Journal article
Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates (2021)
Yu Z, Yu Z, Tan YZ, Bayer CF, Rauh H, Schletz A, März M, Birlem O
Conference contribution
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