Technische Fakultät


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Material Dependent Influence of Ring/Spot Beam Profiles in Laser Powder Bed Fusion (2024) Chechik L, Schwarzkopf K, Rothfelder R, Grünewald J, Schmidt M Journal article Assessment of the Suitability of Selected Linear Actuators for the Implementation of the Load-Adaptive Biological Principle of Redundant Motion Generation (2024) Bartz M, Jüttner M, Halmos F, Uhlich E, Klein M, Drumm P, Dreßler E, et al. Journal article Fostering self-efficacy through usability and emotional product design? An explorative study (2024) Buker T, Kamin S, van Remmen JS, Wartzack S, Miehling J Journal article, Original article GBOT: Graph-Based 3D Object Tracking for Augmented Reality-Assisted Assembly Guidance (2024) Li S, Schieber H, Corell N, Egger B, Kreimeier J, Roth D Conference contribution Tailoring the adhesion of electrophoretic chitosan/bioactive glass coatings by the combined surface pre-treatments of Ti substrates (2024) Kowalczyk A, Sotniczuk A, Kuczyńska-Zemła D, Pura J, Xu Z, Boccaccini AR, Garbacz H Journal article Tailoring the Reaction Pathway for Control of Size and Composition of Silver-Gold Alloy Nanoparticles (2024) Traore N, Berthold M, Hartmann L, Schmul P, Apeleo Zubiri B, Spiecker E, Peukert W Journal article, Original article Supported Catalytically Active Liquid Metal Solutions: Liquid Metal Catalysis with Ternary Alloys, Enhancing Activity in Propane Dehydrogenation (2024) Moritz M, Maisel S, Raman N, Wittkämper H, Wichmann C, Grabau M, Kahraman D, et al. Journal article Interlayer growth of SiC nanowires in graphene aerogel for thermal conductivity enhancement of epoxy resin and its mechanism (2024) Zhao X, Wu W, Drummer D, Wang Y, Liu C, Li S, Lu Z Journal article Enhanced Photostability of Lead Halide Perovskite Nanocrystals with Mn3+ Incorporation (2024) Hu H, Fehn D, Barr M, Harreiß C, Zhao Y, Meyer K, Brabec CJ, et al. Journal article Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz (2024) Pfahler T, Breun S, Engel L, Geissler C, Schür J, Vossiek M Journal article