Advancing Microelectronics
ISSN: 2222-8748
Publisher: International Microelectronics and Packaging Society
Publications (2)
Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024)
Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J
Journal article
Additive metallization of alumina with copper-titanium powder blends for power electronic applications (2023)
Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J
Journal article