International Symposium on Microelectronics

ISSN: 2380-4505
Publisher: IMAPS

Publications (1)

close-button

Types of publications

Journal article
Unpublished / Preprint

Publication year

From
To

Abstract

Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging (2020) Häußler F, Shen S, Petillon S, Weser S, Haybat M, Eberhardt W, Zimmermann A, Franke J Journal article