Journal of Electronic Packaging

Journal Abbreviation: J ELECTRON PACKAGING
ISSN: 1043-7398
Publisher: American Society of Mechanical Engineers (ASME)

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Abstract

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article