Journal of Microelectronics and Electronic Packaging
ISSN: 1551-4897
eISSN: 1555-8037
Publisher: International Microelectronics And Packaging Society
Publications (6)
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board (2022)
Müller J, Letz S, Simon FB, Bayer CF, Schletz A, Görlich J, Nishimura T
Journal article
Stackable SiC-embedded ceramic packages for high-voltage and high-temperature power electronic applications (2019)
Bach HL, Dirksen D, Blechinger C, Endres TM, Bayer CF, Schletz A, März M
Journal article
Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes (2017)
Stoll T, Syed Khaja AH, Franke J
Journal article
Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers (2017)
Kästle C, Syed Khaja AH, Franke J
Journal article
Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers (2017)
Lorenz L, Nieweglowski K, Wolter KJ, Loosen F, Lindlein N, Bock K
Journal article, Review article
Electrical and mechanical investigations on copper circuit paths coated on fiber-reinforced plastics by atmospheric plasma technology (2015)
Schramm R, Reitberger T, Franke J
Journal article, Original article