Microelectronics Reliability
Journal Abbreviation: MICROELECTRON RELIAB
ISSN: 0026-2714
Publisher: Elsevier
Publications (23)
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024)
Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J
Journal article
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography (2023)
Käsbauer M, Dreher P, Sippel M, Schmidt R
Journal article
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation (2023)
Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J
Journal article
Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study (2023)
Zhao D, Letz S, Leib J, Schletz A
Journal article
Impact of THT-hole dimensioning on manufacturability in selective wave soldering (2022)
Seidel R, Ockel M, Franke J, Kästle C
Journal article
Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering (2022)
Seidel R, Ahrens T, Friedrich J, Reinhardt A, Franke J
Journal article
Automated quantitative analysis of void morphology evolution in Ag[sbnd]Ag direct bonding interface after accelerated aging (2021)
Yu Z, Xu T, Letz S, Bayer CF, Schletz A, März M
Journal article
Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test (2020)
Zhao D, Letz S, Yu Z, Schletz A, März M
Journal article, Original article
A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices (2019)
Schriefer T, Hofmann M
Journal article
Thermal performance analysis of GaN nanowire and fin-shaped power transistors based on self-consistent electrothermal simulations (2018)
Kamrani H, Yu F, Frank K, Strempel K, Fatahilah MF, Wasisto HS, Roemer F, et al.
Journal article