Quantification of the temperature-dependent evolution of defect structures in a CoNi-base superalloy (2022) Bezold A, Volz N, Lenz M, Karpstein N, Zenk C, Spiecker E, Göken M, Neumeier S Journal article Tuning mechanical properties of ultrafine-grained tungsten by manipulating grain boundary chemistry (2022) Wurmshuber M, Jakob S, Doppermann S, Wurster S, Bodlos R, Romaner L, Maier-Kiener V, Kiener D Journal article, Original article Phase constitution and microstructure of the NbTiVZr refractory high-entropy alloy solidified upon different processing (2021) Andreoli AF, Mendes RG, Witusiewicz VT, Shuleshova O, Van Huis MA, Nielsch K, Kaban I Journal article Energy-storage-efficient 0.9Pb(Mg1/3Nb2/3)O3–0.1PbTiO3 thick films integrated directly onto stainless steel (2021) Sadl M, Condurache O, Bencan A, Dragomir M, Prah U, Malic B, Deluca M, et al. Journal article Shearing mechanisms of co-precipitates in IN718 (2021) Zenk CH, Feng L, Mcallister D, Wang Y, Mills MJ Journal article Rapid fabrication and interface structure of highly faceted epitaxial Ni-Au solid solution nanoparticles on sapphire (2021) Herre P, Will J, Dierner M, Wang D, Yokosawa T, Zech T, Wu M, et al. Journal article, Original article Dopant-segregation to grain boundaries controls electrical conductivity of n-type NbCo(Pt)Sn half-Heusler alloy mediating thermoelectric performance (2021) Luo T, Serrano-Sanchez F, Bishara H, Zhang S, Villoro RB, Kuo JJ, Felser C, et al. Journal article Element-resolved local lattice distortion in complex concentrated alloys: An observable signature of electronic effects (2021) Oh HS, Odbadrakh K, Ikeda Y, Mu S, Körmann F, Sun CJ, Ahn HS, et al. Journal article Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films? (2021) Liebig JP, Mackovic M, Spiecker E, Göken M, Merle B Journal article, Original article In situ study of non-equilibrium solidification of CoCrFeNi high-entropy alloy and CrFeNi and CoCrNi ternary suballoys (2021) Andreoli AF, Shuleshova O, Witusiewicz VT, Wu Y, Yang Y, Ivashko O, Dippel AC, et al. Journal article